Objective
The SAMPE International University Student Leadership Experience Award program invites student leaders to attend the annual SAMPE Spring Conference & Exhibition for a week of networking with peers and professionals, learn about career opportunities in the materials and process engineering community, and meet future employers.
Award Benefits:
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Complimentary Premium Conference Registration ($1,155 value!)
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Up to $500 Round-trip economy airfare/travel to Indianapolis from anywhere in the U.S., Canada and Mexico.
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Five (5) nights hotel accommodation at a SAMPE-contracted/preferred Hotel.
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Five (5) days of networking, exhibits, technical education, and special events.
Eligibility Requirements – You must:
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Be a current member of an active SAMPE North America Student Chapter.
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Be 18 years of age or older.
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Be currently enrolled in an upper division or graduate degree program at a college or university.
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Be a continuing student in advanced materials curriculum in the current academic year.
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Not have been awarded this before.
Travel:
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SAMPE will reimburse the award recipient up to $500 for airfare, train/interstate bus transportation, or mileage to/from origination (anywhere on in the U.S., Canada and Mexico) and Indianapolis.
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SAMPE will process reimbursement after the conference upon validation of attendance to required events and completion of exit interview.
Ground Transportation:
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Local transportation (e.g., rideshare, city bus/rail, taxi, parking or rental cars) are not included and are the responsibility of the award recipient.
Hotel Accommodations:
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The sharing of rooms with other award recipients is required for SAMPE to cover the full cost of five (5) nights hotel accommodation; Award recipients will be assigned by SAMPE staff according to gender identity.
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Award recipients who prefer their own accommodation must pay for all five (5) hotel nights at the time of check-in. SAMPE will reimburse 50% of the cost of hotel accommodation upon validation of attendance to required events and completion of exit interview.
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A credit card deposit/authorization is required at check-in for incidentals only, or for deposit/payment authorization of room nights and incidentals.
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Room upgrades and guests are the responsibility of the award recipient; Special requests or special room types are not guaranteed.
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SAMPE reserves the right to not reimburse the cost of accommodation at hotels that are not contracted by SAMPE.
Meals:
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The Student Welcome dinner, President’s and other receptions, Student Leadership and Awards Keynote Breakfasts are included.
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All other meals are the responsibility of the award recipient.
Required Events:
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Award recipients are expected to attend a minimum of 11.5 hours of conference programming, plus special events and exit interview as follows:
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Student Welcome Dinner
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President’s Reception
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One (1) Tutorial or One (1) Offsite tour (180 Minutes)
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Opening Keynote (90 minutes)
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Conference: 240 minutes / 4 hours of featured sessions or Technical Paper presentations.
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Student Leadership Awards Breakfast
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Awards Keynote Breakfast
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Attendance will be validated by badge scan data.
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Award recipients will not be excused from attending the required events to present technical papers nor for other student competitions.
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Award recipients are required to participate in a brief exit interview regarding their experience at the SAMPE Conference & exhibition.
Guests:
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The SAMPE Conference & Exhibition is open to the public to purchase registration.
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The benefits of this award program are intended for the award recipient only.
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SAMPE does not extend award benefits to individuals other than award recipients.
How to apply:
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Click here to start your application
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Complete Sections A-F; all fields are required.
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Submit your application by 11:59 p.m. (Pacific), February 15, 2025.
Support:
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Questions? Need help with your application? Contact us at +1.626.521.9460 or info@sampe.org
Winners 2024
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Christopher Clark, Aerospace Engineering, University of Maryland-College Park
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Martin Giersberg Sola, M.Sc., IKV-Institute for Plastics Processing, RWTH Aachen University
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Matthew Godbold, Mechanical Engineering, University of South Carolina
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Ariel Hall, Polymer Materials Engineering, Western Washington University
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Grace Johnson, Aerospace Engineering, University of Maryland-College Park
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Max Kauphusman, Composite Materials Engineering, Winona State University
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Lane McDermott, Aerospace Engineering, University of Maryland-College Park